Card CompactPCI® Serial CPU SC8-FLUTE

CompactPCI® Serial CPU Card, Low Power, Intel® Atom™ x6000RE SoC (Elkhart Lake)

Tính năng chính

  • CompactPCI® Serial (PICMG® CPCI-S.0) System Slot Controller
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • Mounting height 3U
  • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
  • Front panel I/O for versatile system configuration (3 x USB3/DisplayPort, 3 x 2.5Gbps Ethernet)
  • Backplane communication via CompactPCI® Serial connectors
  • On-board PCIe® mezzanine expansion option for mass storage modules or side cards
  • Side cards and low profile mass storage modules available as COTS and also as custom specific

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SC8-FLUTE là bo mạch CPU CompactPCI® Serial công suất thấp, trang bị bộ xử lý Intel® Atom™ x6000RE (Elkhart Lake Industrial) System-on-Chip. Mặt trước được trang bị 3 giắc cắm Ethernet RJ45 2,5Gbps và 3 đầu nối USB3/DisplayPort Type-C. Bo mạch được trang bị RAM DDR4 IBECC 16GB hàn trực tiếp và ngoài ra còn có một khe cắm DDR4 SODIMM cho 16GB khác. Bộ lưu trữ SSD PCIe® x4 tốc độ cao có sẵn thông qua các mô-đun mezzanine cấu hình thấp (lắp ráp 4HP) hoặc các card multi-function side cards (8HP). Các connector của backplane SC8-FLUTE tuân thủ thông số kỹ thuật của bo mạch hệ thống CompactPCI® Serial, phù hợp để mở rộng hệ thống hợp lý thông qua PCIe®, SATA và USB3. Tùy chọn, có sẵn tối đa 8 cổng GbE thông qua mô-đun mezzanine.

 

Processor
  • Intel® Atom® Industrial SoC x6000RE Series (Elkhart Lake)

  • x6425RE • 4 Cores • 1.9GHz • 12W TDP • 400MHz/32EUs Gfx
  • x6416RE • 4 Cores • 1.7GHz • 9W TDP • 450MHz/16EUs Gfx
  • x6414RE • 4 Cores • 1.5GHz • 9W TDP • 400MHz/16EUs Gfx
  • x6214RE • 2 Cores • 1.4GHz • 6W TDP • 400MHz/16EUs Gfx
  • x6212RE • 2 Cores • 1.2GHz • 6W TDP • 350MHz/16EUs Gfx
  • all frequencies not final and subject to change

    Intel® Atom® Industrial FuSa SoC x6000FE Series (Elkhart Lake)

  • x6427FE • 4 Cores • 1.9GHz • 12W TDP • 400MHz/32EUs Gfx • FuSa
  • x6200FE • 2 Cores • 1.0GHz • 4.5W TDP • tbd MHz/tbd EUs Gfx • FuSa
  • italic grey: SKUs not plan of release

  • In-band ECC
  • Intel® Programmable Services Engine
  • Intel® Time Coordinate Computing (Intel® TCC) and TSN
  • Operating life 10 years up to 100% active
  • Ta -40°C to 85°C
Memory
  • Integrated memory controller fo up to 32GB DDR4 w. IBECC, 3200MT/s
  • 16GB Soldered memory for rugged applications
  • 16GB SODIMM socket
Front I/O Interface

Front Panel I/O (4HP)

  • 3 x 2.5 Gigabit Ethernet RJ45 (2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te)
  • 3 x DisplayPort (Type-C Alt Mode)
  • 3 x USB 3 Type-C (same as DP connectors), 2 x USB 3.1 Gen2 10G (top & middle receptacles), 1 x USB 3.1 Gen1 5G (lowest Type-C)

Front Panel I/O (8HP)

  • Variety of side cards available, common front panel 8HP/12HP with CPU card
  • Various I/O ports e.g. UART, Audio, RJ45 Ethernet, M12-X Ethernet, Wireless (SMA)
  • Custom specific front panel and side card design
Expansion

Local Expansion

  • Mezzanine side card connectors for optional local expansion
  • HSE1 – High speed expansion connector, PCIe® Gen3 fully configurable, derived from EHL SoC
  • HSE2 – High speed expansion connector, PCIe® Gen3 configured 4×1, via PCIe® packet switch
  • EXP – Sideband expansion connector, e.g. eSPI, Audio, UART (from EHL SoC)
  • 4HP Low profile mezzanine module options (to be ordered separately)
  • S20-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x Type-C USB F/P connector
  • S40-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C USB F/P Connector
  • S42-MC Mezzanine module – 1 x M.2 2280 NVME SSD socket, 2 x Mini Card sockets
  • S43-WLAN Mezzanine module – M.2 2280 SSD socket, M.2 2230 SSD socket, M.2 Wi-Fi module socket
  • S48-SSD Mezzanine Module – 2 x M.2 2280 NVME SSD sockets, 1 x USB Type-C
  • S80-P6 Mezzanine module – 1 x M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector
  • S82-P6 Mezzanine module – M.2 NVMe SSD & 4 x GbE NIC via P6 backplane connector
  • S83-P6 Mezzanine module – M.2 NVMe SSD & 4 x 2.5GbE NIC via P6 backplane connector
  • Custom specific module design
  • 8HP Mezzanine side card option (to be ordered separately)
  • SCJ-VEENA Short side card – Quad RJ45 2.5GbE NIC & M.2 SSD storage
  • SCL-RHYTHM Short side card – Quad M12-X GbE NIC & M.2 SSD storage
  • SCY-BOOST Short side card – 2 x M.2 2280 NVMe SSD socket, front panel I/O
  • SCZ-NVM Dual M.2 NVMe SSD, quad UART
  • S02-M12 – RJ45 port 1 replacement by M12-X connector (top or bottom mount)
  • Custom specific side card design
Environment
  • Designed & manufactured in Germany
  • Long-term availability
  • Rugged solution
  • Coating, sealing, and underfilling on request
  • Lifetime application support
  • Operating temperature -40°C to +85°C (industrial temperature range)
  • Storage temperature -40°C to +85°C, max. gradient 5°C/min
  • Humidity 5% … 95% RH non-condensing
  • Altitude -300m … +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF 20.6 years (MIL-HDBK-217F, SN29500 @+40°C)
Certifications
  • EC Regulatory EN55035, EN55032, EN62368-1 (CE)
  • RoHS compliant
  • ISO 9001 certified quality management
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