Modal title ModalDatasheet

• 1 x 204-pin DDR3L SO-DIMM socket support 1333MHz up to 8GB. Default 4GB

• 1 x 2.5" SSD/HDD SATA 2.0 (externally accessible, optional lockable storage available)
• 1 x CFast (externally accessible)

• 4 x LED for power, storage, WWAN, WLAN
• 2 x Externally accessible SIM card socket (selectable)
• 1 x Phone jack 3.5mm for 1 x Mic-in
• 1 x Phone jack 3.5mm for 1 x Line-out
• 1 x Externally accessible 2.5" SATA 2.0 SSD/HDD tray
• 1 x Externally accessible CFast card socket with cover
• 1 x Reset button
• 1 x Type A USB 3.0 compliant host, supporting system boot up
• 4 x Antenna hole for WWAN/WLAN/BT
• 1 x Antenna hole for GPS

• 1 x Circle Type DC Input 9~60VDC with ignition and typical 19W power consumption

- 24VDC (16.8~31.2V), non-isolation
- 36VDC (25.2~46.8V), non-isolation
- 110VDC (77~143V), w/ 3KVDC isolation

• 1 x M12 with two USB 2.0 compliant host, supporting system boot up
• 2 x M12 10/100/1000 Ethernet
• 1 x Phone jack 3.5mm for 1 x Mic-in
• 1 x Phone jack 3.5mm for 1 x Line-out
• 1 x DB-15 VGA, resolution up to 2560 x 1600 @60Hz
• 1 x DP port, resolution up to 2560 x 1600 @60H
• 2 x DB-9 RS-232 (isolation)
• 1 x DB-9 RS-422/485 (isolation)
• 1 x 16-pin terminal block

- 1 x CAN Bus 2.0B (on board)
- 4 x DI, 4 x DO with isolation
Input Voltage (internal type): 5VDC TTL (default)
Input Voltage (source type): 3~12VDC (Programmable Digital output or optional isolation)
Digital output (sink type): 5VDC TTL (default), max current: 20mA
Digital output (source type): 3~19VDC, max current: 150mA

• 1 x Full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM
• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 2.0) for LTE module with 1 x internal, 1 x external SIM
• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 2.0)

• Power input 24/36VDC w/o isolation, 110VDC w/ isolation
• Ignition On/Off control
• Programmable On/Off delay timer
• System wake up event

- Ignition switch
- RTC timer ALARM interrupt
- Cellular MODEM wakeup signal

• System wake up condition

- Wake up event is triggered, and DC input voltage is greater than UVP threshold
- Timer delay is only applicable for ignition on

• System power down condition

- Soft off, or ignition offTimer delay is only applicable for ignition off

• Operating temperatures:

-40°C to 70°C (w/ industrial SSD) with air flow
-20°C to 50°C (w/ commercial HDD) with air flow

• Storage temperatures: -40°C to 85°C
• Relative humidity: 10% to 90% (non-condensing)
• Shock (SSD/HDD):

Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=20g
Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g

• CE
• FCC Class A
• EN 50155: 2017

- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class
- Supply change over class C1, C2
- EMC EN 50121-3-2: 2016
- Environment EN 60068-2-1, EN 60068-2-2
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)

• EN 45545-2:2013+A1:2015 (PCB)

• Dimensions: 260mm (W) x 176mm (D) x 70mm (H) (10.24" x 6.93" x 2.75")
• Weight: 2.5kg

• Windows 8, WES8
• Window 7, WES7
• Linux kernel 3.X

• VTC 6210-RA (P/N: 10V00621003X0)

Intel® Atom™ processor E3845 1.91GHz CPU, 4GB DDR3L SO-DIMM, DC Input 24/36 VDC w/o isolation, VGA/DP output, 2 LAN, 2 x RS-232, 1 x RS-422/485, 4 x GPIO, 3 x USB

• VTC 6210-RF (P/N: 10V00621005X0)

Intel® Atom™ processor E3845 1.91GHz CPU, 4GB DDR3L SO-DIMM, DC Input 110 VDC w/ isolation, VGA/DP output, 2 LAN, 2 x RS-232, 1 x RS-422/485, 4 x GPIO, 3 x USB