Modal title ModalDatasheet

• 2 x M12 X-coded LAN port, 10/100/1000 Mbps
• 1 x Waterproof DC input connector with ignition, male type
• 1 x M8 for 1 x Mic-in, 1 x Line-out
• 2 x Waterproof DB9 (COM1/COM2) for full RS232 (isolation)
• 1 x Waterproof DB9 (COM3) for full RS232/422/485 (isolation)
• 1 x M12 A-coded 10pin (DIO)

- 4 x DI and 4 x DO (isolation)
- Power in for DIO isolation, 9~36VDC

• 1 x M12 A-coded for 2 x USB 2.0
• 1 x VGA
• 1 x HDMI

• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0 (BIOS selection))
• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0 (BIOS selection)), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM
• 1 x Full size mini-PCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 2 x external SIM
• 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 2 x external SIM
• 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2, PCIe 3.0 (BOM optional)) for LTE/5G NR modem with 2 x external SIM

• 1 x Default U-blox NEO-M8N GNSS module for GPS/Gloness/QZSS/ Galileo/Beidou
• G Sensor (3-axis, 10-bit resolution)

• 2 x LAN, 10/100/1000 Mbps I210/I219 (support iAMT and WOL)

• TPM 2.0: Infineon SLB9665TT2.0FW5.62

• Power input 24 VDC w/o isolation
• Reverse protection, OCP & UVP
• Selectable boot-up & shut-down voltage for low power protection by software
• Setting 8-level power on/off delay time by software
• 10~255 seconds WDT support, setup by software
• SDK (Windows/Linux) including utility and sample code

• Operating temperatures

- EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flow

• Storage temperatures: -40°C~80°C
• Relative humidity: 90% (non-condensing)
• Vibration (random)

- 2g@5~500 Hz (in operation, SSD)

• Vibration (SSD)

- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

• Shock (SSD)

- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g

• CE
• FCC Class A
• EN 50155: 2017

- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)

• EN 45545-2:2013+A1:2015 (PCB)

• Dimensions: 260 x 256 x 84 (W x D x H) (mm)
• Weight: 4.3kg

• Chipset Intel® UHD graphics 630
• 1 x Waterproof VGA up to 1920 x 1200 @ 60Hz
• 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz

nROK 7251-7A (P/N: 10A00725103X0)

Intel® Core™ 9th Gen. i7-9700TE, 2 x 4 GB industrial grade memory, DC input 24V w/o isolation, 1 x VGA, 1 x HDMI, 2 x LAN