Modal title ModalDatasheet

• 1 x 204-pin DDR3L SO-DIMM socket support 1866MHz up to 8GB. default 4GB

• 1 x 2.5” SATA 3.0 external SSD (compatible with 15mm drive)
• 1 x CFast (externally accessible), optional mSATA

• 12 x LED indicators (including 2 x programmable LED)
• 6 x Externally accessible SIM card sockets with cover
• 1 x 2.5" removable SSD tray
• 1 x Externally accessible CFast card socket with cover
• 1 x Reset button
• 1 x Power button
• 1 x USB 3.0 type A (5V/0.9A)
• 14 x SMA antenna

• 1 x Circle type DC input with ignition

- 24/36 VDC (9~48 VDC), non-isolation

• 1 x M12 with two USB 2.0
• 2 x M12 X-coded LAN port, 10/100/1000 Mbps1 x DB9 (AUDIO), female for 1 x Mic-in, 2 x Line-out
• 2 x VGA
• 1 x HDMI 1.4b
• 1 x DB9 (COM) full RS232 (isolation)
• 1 x DB9 (MULTI PORT) for RS232 TX/RX, RS485 (all w/ isolation), USB 2.0
• 1 x 18-pin terminal block

- 1 x CAN Bus 2.0B (on board)
- 4 x DI with isolation
- 4 x DO with isolation
- Vin, GND for GPIO

• 1 x Full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM
• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 2.0), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM
• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 2.0)
• 1 x M.2 3042 Key B socket (USB 2.0, USB 3.0) for LTE/5G NR module with 2 x external SIM
• 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.0, PCIe 2.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM

• 1 x Default u-blox NEO-M8N GNSS for GPS/Glonass/QZSS/Galileo/BeidouG Sensor (3-axis, 10-bit resolution)

• 2-Port LAN, 10/100/1000 Mbps I210-IT GbE, BOM optional 3-port LAN

• TPM 2.0: Infineon SLB9665TT2.0FW5.62 (BOM optional)

• Power input 24/36 VDC w/o isolation
• Selectable boot-up & shut-down voltage for low power protection by software
• Setting 8-level power on/off delay time by software
• Support S3/S4 suspend mode10~255 seconds WDT support, setup by software
• SDK (Windows/Linux) including utility and sample code

• Operating temperatures

- EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ industrial SSD) with air flow

• Storage temperatures: -40°C to 80°C
• Relative humidity: 10% to 90% (non-condensing)
• Vibration (random)

- 2g@5~500 Hz (in operation, SSD)

• Vibration (SSD)

- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

• Shock (SSD)

- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g

• CE
• FCC Class A
• EN 50155: 2017

- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-3-2: 2016
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)

• EN 45545-2:2013+A1:2015 (PCB)

• Dimensions: 260mm (W) x 196mm (D) x 70mm (H) (10.24" x 7.79" x 2.75")
• Weight: 2.8kg

• Chipset Intel® HD graphics 505
• 1 x HDMI 1.4b up to 4096 x 2160 @30Hz
• 2 x VGA up to 1920 x 1200 @60Hz

• Windows 10/Linux

• nROK 6221-A (P/N: 10A00622100X0)

Intel Atom® processor E3950 1.6 GHz CPU, 4GB DDR3L SO-DIMM, DC input 24/36 VDC w/o isolation, 2 x VGA, 1 x HDMI, 2 x LAN, 2 x RS232, 1 x RS485, 4 x DI, 4 x DO, 4 x USB