Modal title ModalDatasheet

• 2 x SO-DIMM, DDR4-3200MHz
• 4GB+4GB in default, 64GB in max.
• ECC (in-band ECC), dual- channel support

• 1 x 2.5” SSD (15mm height)
• 1 x mPCIe for mSATA (SATA 3.0)
• 1 x M.2 2242/2280 Key M NVMe SSD (PCIe 4.0x4), Hailo AI card in option

• ATX power button, Reset button
• 9 x LED Indicators, 1 x VGA (DB15), 2 x COM (DB9, RS232/422/485), 1 x Multi-port (DB15, 4xDI, 4xDO, CAN, DR signal) , 1 x Ext. (DB15, reserved), 1 x PR-SMA for GNSS, 4 x PR-SMA for WLAN

I/O ports, Rear-plate

• 2 x Audio jack (Line-out & MIC-in)
• 3 x USB 3.2 type A, 1 x USB 2.0 type A
• 1 x HDMI, 1 x DP, 4 x PoE+ (2.5GbE, RJ45), 1 x COM (DB9, RS232), 1 x GbE, 9~36VDC (3-pin Phoenix), 4 x SMA for WWAN, 4 x antenna holes reserved

I/O ports, side-plate

• 2 x SIM slots (SIM1-1, SIM2-1)

• 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz
• 1 x VGA, up to 2560 x 1600@60Hz
• 1 x DP, 4096 x 2304@60Hz

• 1 x mini-PCIe socket (PCIe 3.0/USB 3.2 + USB 2.0), 2 x micro SIMs supported
• 1 x M.2 3042/3052 Key B socket (USB 3.2), 2 x micro SIMs supported
• 1 x M.2 2230 Key E socket (PCIe 3.0 x2 & USB 2.0), Wi-Fi or Hailo AI card in option

• Nominal voltage: 9~36V
• Cranking voltage: 6V~9V (less than 20 sec)
• OCP & UVP (shut down once exceeding 37V)
• Ignition on/off control & programmable on/off delay timer
• Optional for remote power on/off control

• Operating temperatures: -30°C~65°C (15W TDP)
• Storage temperatures: -40°C~85°C
• Relative humidity: 10%~95% (non-condensing)
• Vibration in operating:

- MIL-STD-810H, 514.8C Procedure 6, Category 4
- IEC 60068-2-64: 2.0g@5~500Hz

Vibration in storage:
- MIL-STD-810G, 514.6E Procedure 1, Category 24, 7.7g

Shock:
- MIL-STD-810G, 516.6 Procedure I, trucks and semi-trailers=40g
- Crash hazard: Procedure V, ground equipment=75g

• CE approval, FCC Class A, UKCA, E13 Certified

• External Cable (option)DB15 multi-port adapter cable, 20cm

• 2.5GbE

2-port independent 2.5GbE, RJ45 connector
- 9K byte jumbo frame
- PTP (IEEE 1588) support
- Controller: Intel® I225-ITGbE1-port independent GbE, RJ45 connector
- vPro (iAMT) support
- 9K byte jumbo frame
- PTP (IEEE 1588) support
- Wake-up function (WoL)
- Boot from PXE (UEFI)USB3 x USB3.2 Gen1:
- Host type-A connector
- 5V@900mA each
- Up to 10Gbit/s link speed & compliance with USB 2.0 (LS/FS/HS link speed)

1 x USB 2.0, host type-A , 2 x USB 2.0 wafte-rtype reservedSerial Port

2 x full RS232/422/485, selectable

1 x full RS232, 1 x full RS232 wafer-type reserved
- RS232 working voltage, +- 9V, baud rate up to 115.2kb/s

• Audio

Line-out, unbalance stereo, left & right channel

MIC-in, stereo

Line-in reserved (wafer connector)

• MEMS Sensor

3D accelerometer and 3D gyroscope

Controller: ST LSM6DSLTR

• DI/DO4-bit input

- Source: 9~36VDC (12V@1.1mA/24V@2.2mA)

- External: 0~33VDC pull-high, high-level, 3.3 -33 VDC; low-level, 0-2 VDC

4-bit output

- Source: 9~36VDC (nominal 35mA@24V):

- External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)

Source or external can be selected by DIP switch (default: source type)

• CAN bus

1 x CAN 2.0A/ 2.0B

IEC 61000-4-2 Electrostatic Discharge (ESD): ± 8KV/15KV (contact/air)

2.5KV isolated

• GNSS

U-blox NEO-M9N GNSS module for GPS/GLONESS/QZSS/Galileo/Beidou

Optional DR (Dead Reckoning) function, NEO-M8U/M8L

Dimensions & Weight

• 210.0mm x 173.0mm x 75.0mm (w/o mount brackets)
• 234.0mm x 173.0mm x 81.0mm (w/ mount brackets)
• Weight: 3.5kg

• Linux (Ubuntu 18.04)

• VTC 7260-5HBIoT (P/N: TBC)

Intel® Core™ i5 (Tiger Lake UP3), 2 x 2.5GbE + 1 x GbE, 1 x USB 2.0, 3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN

• VTC 7260-7HBIoT (P/N: TBC)

Intel® Core™ i7 (Tiger Lake UP3), 2 x 2.5GbE + 1 x GbE, 1 x USB 2.0, 3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN