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• NVIDIA® GEFORCE® GTX 1650 SUPER up to 100W, 1280 CUDA® cores, 4GB GDDR6

• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0)
• 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM
• 1 x Full size mini-PCIe socket (

• 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou
• G Sensor (3-axis, 10-bit resolution)

• 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE
• 2-Port LAN 10GbE SFP+ (optional)
• 4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional)

• TPM 2.0: Infineon SLB9665TT2.0FW5.62

• 12 x LED indicators (including 2 x programmable LED)
• 1 x HDMI 1.4b
• 1 x VGA
• 1 x M12 A-coded connector for 2 x USB2.0
• 3 x USB 3.1 Gen 2 type A (5V/1A)
• 1 x USB 3.1 Gen 1 type A (5V/1A)

• Power input 24VDC/110VDC w/ isolation
• Selectable boot-up & shut-down voltage for low power protection by software
• Setting 8-level power on/off delay time by software
• Support S3/S4 suspend mode0~255 seconds WDT support, setup by software
• SDK (Windows/Linux) including utility and sample code

• Chipset Intel® UHD graphics 630

• Operating temperatures: EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, 100W TDP GPU, industrial SSD) with air flow
• Storage temperatures: -40°C~80°C
• Relative humidity: 90% (non-condensing)
• Vibration (random)

- 2g@5~500 Hz (in operation, SSD)

• Vibration (SSD)

- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

• Shock (SSD)

- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g

• CE
• FCC Class A
• EN 50155: 2017

- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)

• EN 45545-2: 2013+A1:2015 (PCB)

• Dimensions: 483 x 400 x 95 (W x D x H) (mm)

*Please reserve total 3U height for aROK 5510 in rack

• Weight: 8.5kg

• Chipset Intel® UHD graphics 630
• 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz
• 1 x VGA up to 1920 x 1200 @ 60Hz

aROK 5510 (P/N: 10A20551003X0)

Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU, 4 x DDR4 SO-DMIM, DC input 24 or 110 VDC w/ isolation, 2 x LAN, 3 x mini-PCIe, 3 x M.2, 8 x SIM, 1 x VGA, 1 x HDMI, 2 x RS232, 2 x RS232/422/485, 4 x DI, 4 x DO, 4 x USB 3.1, 2 x USB 2.0